{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "7.0.1" }, "CreationDate": "2024-03-26T16:50:52+03:00" }, "GeneralSpecs": { "ProjectId": { "Name": "Pelt", "GUID": "50656c74-2e6b-4696-9361-645f70636258", "Revision": "rev?" }, "Size": { "X": 79.1, "Y": 46.6 }, "LayerNumber": 4, "BoardThickness": 1.59, "Finish": "None", "ImpedanceControlled": true, "EdgePlating": true }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.175, "PadToTrack": 0.175, "TrackToTrack": 0.2, "MinLineWidth": 0.2, "TrackToRegion": 0.2, "RegionToRegion": 0.2 }, { "Layers": "Inner", "PadToPad": 0.175, "PadToTrack": 0.175, "TrackToTrack": 0.2, "MinLineWidth": 0.2, "TrackToRegion": 0.2, "RegionToRegion": 0.2 } ], "FilesAttributes": [ { "Path": "Pelt-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "Pelt-In1_Cu.gbr", "FileFunction": "Copper,L2,Inr", "FilePolarity": "Positive" }, { "Path": "Pelt-In2_Cu.gbr", "FileFunction": "Copper,L3,Inr", "FilePolarity": "Positive" }, { "Path": "Pelt-B_Cu.gbr", "FileFunction": "Copper,L4,Bot", "FilePolarity": "Positive" }, { "Path": "Pelt-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "Pelt-B_Silkscreen.gbr", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "Pelt-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "Pelt-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "Pelt-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Color": "White", "Material": "Liquid Photo", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.01, "Material": "Epoxy", "DielectricConstant": "3.3", "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Color": "R205G130B0", "Thickness": 0.36, "Material": "FR4", "DielectricConstant": "4.5", "LossTangent": "0.02", "Name": "F.Cu/In1.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In1.Cu" }, { "Type": "Dielectric", "Color": "R109G116B75", "Thickness": 0.71, "Material": "FR4", "DielectricConstant": "4.5", "LossTangent": "0.02", "Name": "In1.Cu/In2.Cu", "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In2.Cu" }, { "Type": "Dielectric", "Color": "R205G130B0", "Thickness": 0.36, "Material": "FR4", "DielectricConstant": "4.5", "LossTangent": "0.02", "Name": "In2.Cu/B.Cu", "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.01, "Material": "Epoxy", "DielectricConstant": "3.3", "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Color": "White", "Name": "Bottom Silk Screen" } ] }